SOLDER ALLOYS

 

Technical Data Sheet Lead Free Solder Alloys

Technical Data Sheet SnPb(Ag) Solder Alloys

Short Properties Overview

 

 

Technical Data Sheet Lead Free Solder Alloys

Technical Data Sheet SnPb(Ag) Solder Alloys

Short Properties Overview

 

 

 

Technical Data Sheet Lead Free Solder Alloys

Technical Data Sheet SnPb(Ag) Solder Alloys

Short Properties Overview

 

LMPA Solder Alloys

SnBi based low melting point soldering alloys

Description

LMPA™ Solder alloys are high purity low melting point soldering alloys.They exhibit very low dross formation in wave soldering machines without nitrogen. The use of LMPA™-Oil is advisable for initial filling and maintenance. In selective soldering machines, the use of nitrogen is advisable. LMPA™ Solder alloys give much less Cu dissolution from the PCB board than Sn (Ag)Cu alloys. Beside their use in wave and selective soldering, the alloys are also available as a solder paste for reflow soldering. The LMPA™ alloys have increased mechanical properties compared to the SnBi(Ag) alloys. This makes them the perfect drop-in alloys for many electronic applications that are today being soldered with Sn (Ag)Cu alloys . The low melting point of LMPA™ alloys allow for lower solder bath temperatures and lower or shorter preheating profiles. This will result in reduced energy consumption, lower costs and increased line capacity and production speeds. Board and components will experience less stress, resulting in less ageing and longer life time of the electronic unit.

 

Key properties

• Fast through hole wetting
• Much less Cu dissolution from the PCB
• Reduced cost of production
• Increased line capacity
• Lower thermal stress on the electronic unit
• Longer life time of the electronic unit

 

Health and safety

Please always consult the safety datasheet of the product.

 

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AJÁNLOTT TERMÉK

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