The design of the machine allows to solder even the most complex cards with a format of max. 500 x 500 x 60 mm while ensuring optimal quality thanks to,
• The inert atmosphere resulting from the fluid (medium) used
• An incomparable temperature delta across the entire component
• No possible handling error during the cycle
The upgrades since the VS-500-IV,
• A high efficiency chiller included
• It can go up to 10 temperature levels
• ESD paint (depending on batches - to be confirmed upon order)
• ESD top glass
• Display of the real-time reflow profile integrated into the machine
• Light signal column
The main applications relate to lead and lead-free soldering of all types of boards even the most complex, conductive adhesives and repair.
The concept of the vapor phase allows today,
• Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs
• Quick return on investment and high capacity for mixed productions
• Optimum soldering quality in inert atmosphere
• Compensation for pressure fluctuations in the tank
• Minimum temperature delta throughout the working area - not achievable with other technologies
• Reduced energy consumption
• Sub-assembly repair: desoldering and resoldering
• High reliability for all types of soldering
• Precision and repeatability
• Possibility of brazing large format 500 x 500 x 60 mm cards in a small footprint
Caractéristiques techniques
Max PCB dimensions |
500 x 500 x 60 mm |
Max. Load capacity |
2 Kg |
Medium capacity |
5 Kg |
Dimensions (L x l x H) |
830 x 775 x 1140 mm |
Installed power |
7.5 KW / H |
Net weight |
260 Kg |
Gross weight |
305 Kg |
Power supply |
3 x 400 V + N +T / 50 Hz |