VS-500 V parna reflow pećnica

Vapor phase soldering system VS-500 V

The design of the machine allows to solder even the most complex cards with a format of max. 500 x 500 x 60 mm while ensuring optimal quality thanks to,


• The inert atmosphere resulting from the fluid (medium) used

• An incomparable temperature delta across the entire component

• No possible handling error during the cycle


The upgrades since the VS-500-IV,


•  A high efficiency chiller included

•  It can go up to 10 temperature levels

•  ESD paint (depending on batches - to be confirmed upon order)

•  ESD top glass

•  Display of the real-time reflow profile integrated into the machine

•  Light signal column

The main applications relate to lead and lead-free soldering of all types of boards even the most complex, conductive adhesives and repair.


The concept of the vapor phase allows today,

• Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs

• Quick return on investment and high capacity for mixed productions

• Optimum soldering quality in inert atmosphere

• Compensation for pressure fluctuations in the tank

• Minimum temperature delta throughout the working area - not achievable with other technologies

• Reduced energy consumption

• Sub-assembly repair: desoldering and resoldering

• High reliability for all types of soldering

• Precision and repeatability

• Possibility of brazing large format 500 x 500 x 60 mm cards in a small footprint


Caractéristiques techniques


Max PCB dimensions

500 x 500 x 60 mm

Max. Load capacity

2 Kg

Medium capacity

5 Kg

Dimensions (L x l x H)

830 x 775 x 1140 mm

Installed power

7.5 KW / H

Net weight

260 Kg

Gross weight

305 Kg

Power supply

3 x 400 V + N +T / 50 Hz